How 18MΩ·cm Water Prevents Chip Defects
How 18MΩ·cm Water Prevents Chip Defects
Why 18.2MΩ·cm Water is Critical for Semiconductor Manufacturing
✔ Prevents micro-contamination - Removes 99.99% particles >0.1μm
✔ Extends equipment lifespan - Eliminates mineral scaling in wafer tools
✔ Boosts yield rates - Reduces chip defects by up to 45%
✔ Meets SEMI F63 standards - Certified for Class 1 cleanrooms
Industry Fact: 90nm chip production requires <1ppt (part per trillion) metal ions
3 System Configurations
1. RO + Mixed Bed (15-18MΩ·cm)
For: Legacy fabs & PCB cleaning
Capacity: 0.5-20 m³/h
2. Double RO + EDI (17-18MΩ·cm)
For: 200mm/300mm wafer lines
Feature: Chemical-free operation
Recovery Rate: 75-85%
3. RO + EDI + Polishing (18.25MΩ·cm)
For: 5nm/3nm advanced nodes
Advantage: <0.1ppb TOC & silica
Technical Specifications
| Parameter | Specification |
|---|---|
| Resistivity | 18.2 MΩ·cm @25°C |
| TOC | <1 ppb |
| Particles | <5/ml (>0.1μm) |
| Flow Range | 0.1-100 m³/h |
| Materials | 316L SS/PVDF/PTFE |
4 Competitive Advantages
✔ AI predictive maintenance - 30% lower downtime
✔ Military-grade filters - 10X longer lifespan
✔ 0.08% failure rate - Industry's most reliable
✔ 14 patents - Including anti-vibration membrane tech
Case Study: Reduced defect density by 38% at TSMC supplier
Core Technologies
1. Pretreatment System
• Multi-media filter: Removes >20μm particles
• Activated carbon: Adsorbs organics (COD<1mg/L)
• Ultrafiltration: 0.01μm pore size for colloids
2. RO Membrane Stack
• Elements: Dow Filmtec/DuPont Hydranautics
• Rejection Rate: 99.7% @ 15-20 bar
3. EDI Module
• Continuous regeneration - No chemical needed
• Voltage: 200-600V DC
• Resin lifespan: 5-8 years
Maintenance Protocol
✅ Daily: Resistivity/TOC monitoring
✅ Weekly: SDI & particle counts
✅ Monthly: CIP membrane cleaning
✅ Quarterly: UV lamp replacement
✅ Annually: Full system validation
Pro Tip: Monitor silica weekly to prevent wafer hazing
Industry Applications
1. Semiconductor
• Wafer cleaning
• Photolithography
• Etching/CVD
2. Flat Panel Display
• LCD/OLED production
• Glass substrate rinsing
3. Advanced Packaging
• 3D IC TSV cleaning
• Flip-chip bumping
